Post Profile

Toshiba Showcases QLC NAND Development Platform At Flash Memory Summit

Tucked in the back of the Microsemi booth we found Toshiba's BiCS Gen 3 768Gbit NAND running. With the show floor closed due to a fire Microsemi gets the credit for showing the first working QLC.
read more


Related Posts

Toshiba to Build New Fab to Produce BiCS NAND Flash

Technology / Hardware : AnandTech

Toshiba this month has announced plans to build a new manufacturing facility to produce its BiCS NAND flash memory. The company intends to start making chips at the new fab in 2018 and currently is not disclosing the planned product...

Toshiba Brings Through-Silicon Vias to NAND Flash

Technology / Hardware : AnandTech

At Flash Memory Summit this week, Toshiba is showing off a NAND flash device packaged using through-silicon vias rather than traditional wire-bonded connections. The NAND flash currently on the market is typically produced in the fo...

Western Digital Announce BiCS4 3D NAND: 96 Layers, TLC & QLC, Up to 1 Tb per Chip

Technology / Hardware : AnandTech

Western Digital on Tuesday formally announced its fourth-generation 3D NAND memory, developed as part of the Western Digital/Toshiba joint venture. The fourth-generation BiCS NAND flash chips from Western Digital feature 96 layers a...

Facebook Asks For QLC NAND, Toshiba Answers with 100TB QLC SSDs With TSV

Technology / Hardware : Tom's Hardware

Facebook asked for denser and cheaper 100TB QLC NAND SSDs at the Flash Memory Summit. Coincidentally, an hour later, Toshiba laid out its ambitious plans to develop 100TB QLC SSDs. According to our calculations, QLC may also work it...

Toshiba's 768Gb 3D QLC NAND Flash Memory: Matching TLC at 1000 P/E Cycles?

Technology / Hardware : AnandTech

Toshiba last week announced its first 3D NAND flash memory chips featuring QLC (quadruple level cell) BiCS architecture. The new components feature 64 layers and developers of SSDs and SSD controller have already received samples of...


Copyright © 2016 Regator, LLC